Click on the advert above to visit the company web site

Product category: Memory Devices and Modules
News Release from: Toshiba Electronics Europe
Edited by the Electronicstalk Editorial Team on 10 September 2007

Wafer fab is ready for Flash expansion

Request your FREE weekly copy of the Electronicstalk email newsletter. News about Memory Devices and Modules and more every issue. Click here for details.

Latest 300mm wafer fabrication facility is expected to start mass production in December 2007 and reach a production capacity of 80,000 wafers a month in the second half of 2008.

Toshiba Corporation and SanDisk Corporation have officially opened Fab 4, the latest 300mm wafer fabrication facility at Toshiba's Yokkaichi Operations, in Mie Prefecture, Japan Responding to continuous rising demand for NAND Flash memory used in a wide range of digital applications, including digital media players, mobile phones, PCs and memory cards, Toshiba started construction of Fab 4 in August 2006