‘Tsop’

An Electronicstalk guide

Start with the news release Device programmer targets flash-memory market from BPM Microsystems, which we summarised at the time by saying "BPM Microsystems will showcase the 3000FS fine-pitch automated device programmer, designed for flash-memory programming, on Adaptsys' stand at the National Electronics Week show. ". Several months prior to that, we featured the news release Ramtron launches F-RAM family from Ramtron International: "Ramtron has launched the first parallel device in a family of parallel and serial F-RAM products that offer high-speed read/write performance, lower-voltage operation and optional device features. ".
 
In October 2008, we covered the news from ON Semiconductor - take a look at ON Semiconductor offers surge protection devices which says: "ON Semiconductor has announced the release of a family of low-capacitance Thyristor Surge Protection Devices (TSPD) designed to protect the next generation of high-speed telecom equipment. ".
 
Take a look also at the news release from Ramtron International, Memory takes the gamble out of system design, as well as Miniature MOSFETs maintain lower on-resistance from Vishay Siliconix, and Low-power SRAMs expand to 64Mbit density from Renesas Technology Europe.
 

Latest stories...
Performance boost for Flash memories (December 2007)

Flash memories feature fast effective read and program performance, which gives systems using the devices fast boot and field update times.

Automotive SDRAMs expand temperature range (November 2007)

Product family covers densities from 16 to 512Mbit and supports both -40 to +85C (A1 grade) and industry leading -40 to +105C (A2 grade) temperature ranges.

Ferroelectric RAM runs up to 2Mbit density (October 2007)

High density FRAM device targets SRAM-based industrial control, metering, medical, automotive, military, gaming and computing applications.

Asynchronous SRAMs support legacy systems (August 2007)

In addition to 1.8, 2.5 and 3.3V SRAMs, Integrated Silicon Solution now has a wide variety of 5V SRAMs from 256Kbit to 4Mbit.

Power switches combine to save handset space (July 2007)

Main battery switch, wall charging switch and USB charging switch elements are combined into a single component.

Package cuts MOSFETs down to size and heat (July 2007)

P-channel power MOSFETs in PowerPAK ChipFET packages promise advanced thermal performance in a compact 3 x 1.8mm footprint.

More options for magnetoresistive RAM (June 2007)

New devices include extended temperature range nonvolatile RAM targeting rugged application environments, such as industrial, military, aerospace and automotive designs.

Mosfets offer 3W dissipation in a tiny package (April 2007)

Vishay Silconix' new PowerPAK ChipFET package offers advanced thermal performance in a compact 3 x 1.8mm footprint.

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