Yextech shows automated X-Ray equipment

A Yestech product story

Edited by the Electronicstalk editorial team Dec 11, 2009

Yestech has exhibited its Automated X-Ray Inspection (AXI) equipment at Productronica, along with its UV and AOI systems.

Andy Bonner, European operations manager for Yestech, said: 'Visitors were particularly impressed by how simply the X-Series AXI could present a 2D slice through the hidden part of an inspected board and by the clarity of the image produced.

'This effortless, automated inspection of areas that could not previously be viewed is due to Yestech's 3D tomosynthesis image gathering technology combined with easy to use programming software.

The X-Series machine features algorithms for detecting BGA soldering faults such as bridging, open circuit, or 'head in pillow' problems.

These form part of the machine's complete inspection capability for solder joints and other critical hidden features found in electronic assemblies, single- and double-sided PCBs and packaged semiconductors.

Users can choose between the two planes of a double-sided PCB for unimpeded automated inspection of solder joints, even where their density is high.