ChipSESD packages help reduce assembly challenges

New ChipSESD packages from TE Connectivity help reduce assembly challenges because they offer the advantages of an active silicon device combined with a traditional SMT passive body package.

Available in 0201 and 0402 sizes, Chip SESDs are said to be easier to install and re-work than traditional semiconductor-packaged ESD devices, as they operate bi-directionally and can be placed onto a PCB with no orientation constraints, eliminating any need for polarity inspection.

The passive packaging of ChipSESDs allows for easy solder inspection after PCB mounting.

Electrical specifications include a surge rating of 2A under 8 x 20us surge and an ESD rating of 10kV contact discharge.

The devices' low-leakage current (1uA max) reduces power consumption and a fast response time (less than 1ns) helps equipment to pass IEC61000-4-2, level 4 testing.

Their input capacitance of 4pF (0201 package) and 4.5pF (0402 package) makes them suitable for applications such as mobile phones and portable devices, digital cameras/camcorders, computer I/O ports, speakers, headphones and low-voltage DE lines.

ChipSESDs are available in two sizes - EIA-0201 (SESD0201P1BN-0400-090) and EIA-0402 (SESD0402P1BN-0450-090).

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