ChipSESD devices help to protect mobile phones

Tyco's 0201- and 0402-size ChipSESD devices help to protect: mobile phones, digital cameras and camcorders, computer I/O ports, keypads, low-voltage DC lines, speakers, headphones and microphones.

The devices, which form part of Tyco's silicon ESD (electrostatic discharge) protection product portfolio, are said to be easier to install and rework than traditional semiconductor-packaged ESD devices.

The ChipSESD package combines the advantages of an active silicon device with a traditional surface-mount technology (SMT) passive packaging configuration.

The SESD0201P1BN-0400-090 (0201 package) and SESD0402P1BN-0450-090 (0402 package) devices' bidirectional operation facilitates placement on the printed circuit board (PCB) without orientation constraints and eliminates the need for polarity inspection.

Unlike conventional ESD diode packaging using pads on the bottom of the device, the ChipSESD devices' passive package also allows for easy solder inspection after the device has been mounted on the PCB.

The ChipSESD devices feature a surge rating of 2A under 8 x 20us surge and an ESD rating of 10kV contact discharge.

The devices' low-leakage current (1uA max) reduces power consumption and a fast response time (less than 1ns) helps equipment to pass IEC61000-4-2, level 4 testing.

They have an input capacitance of 4pF (0201 package) and 4.5pF (0402 package).

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