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Product category: Reference Designs
News Release from: TTPCom | Subject: ULCH design
Edited by the Electronicstalk Editorial Team on 7 February 2006

Design points the
way to sub-$20 handsets

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A complete reference design addresses the growing ultra-low-cost handset market segment

TTPCom has developed a complete reference design to address the growing ultra-low-cost (ULC) handset market segment. The design, which includes TTPCom's Ajar ULC application suite, protocol software and baseband chipset engine, will enable handset manufacturers and semiconductor vendors to deliver the sub-$20 ex-factory handset that the industry now sees as a key milestone in serving the next one billion mobile phone customers.

Successfully meeting the aggressive cost targets for the ultra-low-cost handset (ULCH) market requires a tightly specified product based on a fully integrated system design which allows an optimised hardware/software balance.

Unique in its position as a provider of mobile handset intellectual property from antenna to applications, TTPCom now brings the benefits of its mature technology to this market.

Further technology innovation has resulted in a step change in the handset cost.

TTPCom has developed a fully costed bill of materials (BoM) based on the reference design, using TTPCom's technology, which also includes all other handset parts including battery, display and casing to deliver a ULCH design below the $20 barrier.

'Every TTPCom product is designed in the context of the whole system', comments Tony Milbourn, TTPCom's Managing Director.

'This approach allows us to extract the maximum possible functionality out of each individual function in relation to the others and to innovate in terms of understanding the tradeoffs in the components and design'.

'We can help handset manufactures deliver a sub-$20 device'.

'In fact, with the right partners, we believe we can reduce costs even further'.

TTPCom's modular approach to design has enabled the removal of any nonessential functionality to deliver proven technology optimised for the ULC market with particular focus on three key elements.

TTPCom Ajar ULC is a small-memory-footprint version of the TTPCom Ajar platform - the definitive mobile applications suite.

Ajar ULC provides an intelligent framework, user interface toolset and all the software required for the ultra low cost market in a format that is easy to adapt and integrate.

Ajar ULC saves more than 500Kbyte of memory over a comparable application layer.

The second element is an optimised 2G protocol stack.

Every year, TTPCom's GSM/GPRS protocol stack is employed in millions of handset products on multiple networks around the world.

This maturity in addition to its very small memory footprint combine to deliver a robust solution for use in ULC handsets.

Third comes the TTPCom CBEmacro 2G ULC.

This modem technology includes all the required processors, peripherals, communications hardware and external interfaces, delivered as a silicon intellectual property (IP) core.

Gate counts and memory footprint are optimised for ULCH products and its target size of 10mm2 or less in 0.13um process technology is extremely competitive.

With this ULCH design, TTPCom is now actively engaging with semiconductor manufacturers and handset manufacturers as key partners in bringing the next step-change in cost reduction for the ULCH market.

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