Product category: Reference Designs
News Release from: TTPCom | Subject: 3G technology set
Edited by the Electronicstalk Editorial Team on 24 January 2003
Complete package for 3G
IC and handset development
TTPCom has developed a complete 3G technology set enabling silicon vendors and handset manufacturers to develop stand-alone 3G or dual-mode 3G/GSM devices for launch in 2004
For silicon vendors TTPCom offers 3G intellectual property (IP) in the form of baseband and radio chip designs. In this area TTPCom has developed a range of flexible IP building blocks that enable silicon vendors to complement their existing in-house technology in the development of dual mode products.
This article was originally published on Electronicstalk on 24 January 2003 at 8.00am (UK)
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The company has already engaged with two silicon companies to utilise this portable IP approach for the development of dual mode 3G/GSM baseband chips and is now in the process of validating the system solution for use by handset manufacturers.
"TTPCom's flexible approach enables our semiconductor partners to capitalise on the investments they have already made in developing wireless technology and to realise integrated dual mode technology.
If that means our partners already have GSM technology then TTPCom can provide the 3G upgrades; if they already have 3G then we can provide GSM technology; and for those starting from scratch, we can provide a fully integrated dual mode 3G/GSM solution", stated Chris Tunsley, 3G Programme Manager at TTPCom.
"We aim to bring maximum flexibility to our customers and thereby offer them the fastest possible route to market for single-mode 3G, single-mode GSM or dual-mode 3G/GSM products".
For handset manufacturers TTPCom offers 3G/GSM dual mode protocol software that is warranted to work with silicon from any of its semiconductor partners.
Further reading
Systems integrator adds expertise to ecosystem
TietoEnator, one of Europe's largest IT and software services providers, has joined the Ajar platform ecosystem
Engineers wanted for mobile platform development
TTPCom is recruiting a significant number of engineers to join the development team working on its Ajar platform - the definitive mobile applications framework for mass market handsets
Protocol software goes out with single-chip phone
TTPCom has extended its partnership with Silicon Laboratories to allow its GSM/GPRS protocol software to be distributed directly on Silicon Laboratories' AeroFone single-chip cellular platform
Terminal manufacturers licensing TTPCom's protocol software now, and working with TTPCom's silicon partners, will be well placed to offer dual mode handsets to market in 2004.
In addition TTPCom provides a flexible applications framework that enables manufacturers to quickly customise their handsets with new services and applications, such as video streaming and 3D downloadable games, all designed to take advantage of the higher bandwidth available on 3G networks.
"After over three years of development effort TTPCom is now uniquely positioned to support developers of 3G terminals irrespective of their current level of technology.
We have 'all the bases covered' because for silicon companies we offer dual mode IP for the development of radio and baseband chips; for terminal manufacturers we offer 3G protocol and application software that is compatible with our silicon partners' chips, and for those new to the market we offer complete 3G handset design services", stated Richard Fry, Sales and Marketing Director at TTPCom.
"Our systems view, 'from applications to antenna', gives us a unique insight into the interrelationships of all this technology and enables us to offer fully integrated systems solutions that can meet the price and performance expectations that end users already enjoy with 2.5G terminals".
TTPCom's radio RFIC technology is at an advanced stage, with first silicon from its partner, Matsushita Electric Industrial (MEI) having successfully completed functional tests.
From 18th to 21st February 2003 TTPCom will be demonstrating its latest technology on Stand A3, Hall 1 at the 3GSM World Congress in Cannes, France.
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