TSMC updates 0.13um process technology

TSMC has enhanced its 0.13um process technology with 1.5/6/32V technology, targeted at high resolution mobile handset display drivers.

The high-yield process features an aluminium copper (AlCu) backend metal scheme and helps meet energy reduction targets.

It also reduces die size in next-generation high-resolution display driver ICs.

The growing popularity of mobile TV and internet browsing has led to a demand for portable displays with high resolution and excellent power performance.

The 1.5/6/32V technology cuts die size requirements for high-resolution mobile handset display drivers while providing the high drive voltages required at the smaller 0.13um geometry.

TSMC's new process is compact and provides the smallest Sram bit cell of any commercial foundry without compromising speed and stand-by power.

It also adds the necessary core voltage under-drive range, at 1.2V, to meet stringent green panel requirements.

Innovative fuse implementations simplify display optimisation and matching during production testing.

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