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Product category: Optoelectronic Sensors, Switches and Receivers
News Release from: Toshiba Electronics Europe | Subject: ET8EE6-AS and ET8EF2-AS
Edited by the Electronicstalk Editorial Team on 18 October 2006

Shrinking sensors maintain handset
resolution

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CMOS image sensors enable development of smaller, space-saving camera modules for cellular phones and other camera-enabled mobile devices.

Toshiba Electronics Europe (TEE) has announced the further expansion of its industry-leading Dynastron CMOS image sensor product line with the addition of two new chips: the 3.2Mpixel ET8EE6-AS CMOS image sensor and 2.0Mpixel ET8EF2-AS CMOS image sensor SoC with integrated image-signal processor (ISP) With a pixel pitch of just 2.2um, a significant advance in cell-size miniaturisation compared with the 2.7um pixel pitch of previous 2 and 3.2Mpixel products, the new devices enable development of smaller, space-saving camera modules for cellular phones and other camera-enabled mobile devices