Product category: Communications ICs (Wireless)
News Release from: Texas Instruments (April 2001-March 2006) | Subject: BRF6100
Edited by the Electronicstalk Editorial Team on 23 June 2003
Digital RF chip
provides frugal Bluetooth module
The newest Bluetooth module for mobile devices from Taiyo Yuden is based on a single-chip Bluetooth solution from Texas Instruments
The module includes all necessary external components, consumes up to 40% less power than competitive products and is extremely small. 'Our newest module is the result of our synergistic collaboration with TI', said Dr Yukihiro Kawada, Senior Operating Officer, Taiyo Yuden. 'We are delighted to be able to offer a simple, easy-to-implement Bluetooth solution for mobile terminal manufacturers that will barely impact the power consumption of their devices'.
This article was originally published on Electronicstalk on 23 June 2003 at 8.00am (UK)
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Digital RF enables sub-$4 single-chip Bluetooth
Texas Instruments reckons the BRF6100 is the first single-chip Bluetooth solution to integrate a digital RF processor and Bluetooth baseband on one chip to reduce cost and minimise board space
Ideal for mobile device manufacturers wanting to quickly and easily add Bluetooth functionality, the module is based on TI's BRF6100 single-chip solution - the first and only Bluetooth chip to use digital radio frequency (RF) technology.
Leveraging TI's patented digital RF and 0.13um process, the BRF6100 is the industry's smallest, most power efficient and least expensive Bluetooth solution.
'Working together, Taiyo Yuden and TI developed a highly compelling Bluetooth module that will help enable mass adoption of Bluetooth technology in cellular', said Ari Rauch, General Manager, TI Short Distance Wireless.
'This product brings us one step closer to TI's goal of making Bluetooth ubiquitous in mobile phones, PDAs and other cellular devices'.
The module, which is only 8.4 x 8.4 x 1.4mm, has passed all internal qualification tests.
It also integrates seamlessly with all TI wireless chipset solutions and OMAP application processors, making it compatible with a significant number of mobile devices on the market - today and in the future.
Taiyo Yuden demonstrated the new module this week at the Bluetooth World Congress in Amsterdam.
The module is currently sampling and will be available in production quantities in October 2003.
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