Product category: Reference Designs
News Release from: Texas Instruments (April 2001-March 2006) | Subject: BRF6100
Edited by the Electronicstalk Editorial Team on 24 June 2003
Reference design is
complete Bluetooth headset
Teleca and Texas Instruments have unveiled a new Bluetooth headset solution that enables manufacturers to bring small, highly competitive wireless headsets to market quickly
The reference design increases wireless device battery life more than two times and is extremely cost effective. Available to manufacturers today, the solution is based on TI's single-chip Bluetooth solution and Teleca's embedded Bluetooth stack and has passed all internal qualification tests.
This article was originally published on Electronicstalk on 24 June 2003 at 8.00am (UK)
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Digital RF enables sub-$4 single-chip Bluetooth
Texas Instruments reckons the BRF6100 is the first single-chip Bluetooth solution to integrate a digital RF processor and Bluetooth baseband on one chip to reduce cost and minimise board space
'To ensure mass adoption of Bluetooth headsets, manufacturers and solution providers must deliver small, inexpensive, power efficient, differentiated products with short lead time', said Jorgen Simonsson, Marketing Director, Teleca Systems.
'TI's power-efficient single-chip Bluetooth solution allowed Teleca to design a Bluetooth headset solution that addresses reduced price, size and power consumption'.
'We designed our Bluetooth chip to meet the unique needs of wireless device manufacturers, which also makes it ideally suited for the Bluetooth headset market', said Ariel Moshkovitz, Worldwide Marketing Manager, TI Short Distance Wireless.
'Teleca's technical expertise and ability to take specific customer needs to an end product, and TI's ability to deliver the lowest-power single-chip Bluetooth solution, means significant reductions to size and cost for manufacturers looking for a highly differentiated, easy-to-manufacture product'.
The BRF6100 single-chip Bluetooth solution leverages TI's patented digital radio frequency (RF) technology and 0.13um process to achieve significant reductions to size, cost and power consumption.
Creating an efficient one-stop shop from reference design to industrialisation, the Bluetooth headset solution also includes Teleca's small footprint Bluetooth stack.
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