Product category: Intellectual Property Cores
News Release from: Texas Instruments (April 2001-March 2006)
Edited by the Electronicstalk Editorial Team on 2 August 2001
TI arms itself
with latest core technology
Texas Instruments has signed an agreement to license and develop enhanced solutions based on the new ARMv6 architecture
This advanced architecture, which has resulted from a two-year collaboration between the two companies, will enable TI to be the first to deliver increased system performance and battery life for next-generation (2.5 and 3G) wireless handsets by seamlessly connecting its programmable DSPs with the new ARM architecture.
This article was originally published on Electronicstalk on 2 August 2001 at 8.00am (UK)
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'TI, as a driving partner of ARM for more than seven years, has been and continues to be a key contributor to enabling ARM technical excellence.
Their innovation and expertise in many markets and especially the wireless marketplace has helped us shape the ARM microprocessor roadmap, enabling us to better meet the growing demands for higher performance with lower power in the embedded space', said Robin Saxby, chairman and CEO, ARM.
'We expect that the combination of TI's industry-leading DSP technology with the ARMv6 microprocessor architecture will enhance TI's OMAP architecture offering as an important standard for next-generation wireless multimedia devices'.
The ARMv6 architecture enables high levels of integration between TI's leading DSP technology and ARM's advanced microcontroller architecture.
The two year-long collaboration between ARM and TI led to the incorporation of several new features in the next-generation architecture to improve data synchronisation, shared memory management, and the efficient operation of advanced operating systems.
Further reading
Batra and Sengupta named as young innovators
Two TI engineers, Dr Anuj Batra and Dr Chaitali Sengupta, have been named to the 2004 list of the world's 100 Top Young Innovators by Technology Review, MIT's magazine of innovation
Live webcasts tackle analogue theory
Analogue design engineers are invited to log on at 1100 CDT (1900 BST) on Wednesday 8th September 2004, for the first of three, live analogue e-labs presented by Texas Instruments
Collaboration targets global 3G chipset
Texas Instruments and NTT DoCoMo are to develop a cost-competitive, multimode UMTS (W-CDMA/GSM/GPRS) chipset to serve the Japanese, US and worldwide 3G handset market
These new features, along with others, will offer the increased performance and low-power consumption required to run real-time audio and video applications.
Full technical details of the ARMv6 architecture will be introduced at Microprocessor Forum 2001 in October.
Product implementations of this new architecture will be available from ARM, as licensable IP cores for implementation within its silicon and systems partners' ASIC or ASSP designs.
'For more than seven years, TI's dual-core digital baseband, based on TI's DSP technology and an enhanced ARM microprocessor core, has been the standard for delivering the best power and performance required to drive today's wireless handsets,' said Gilles Delfassy, senior vice president, general manager, Texas Instruments Wireless Business Unit.
'By seamlessly combining TI's next-generation DSP technology with the first microprocessor core based on the ARMv6 architecture, we will extend this standard in 2.5 and 3G wireless devices including TI's OMAP architecture, established as the de facto standard for next-generation wireless handsets and advance mobile information devices'.
Unveiled in May 1999, TI's OMAP architecture delivers advanced wireless Internet and multimedia functionality, without compromising battery life essential to wireless communications devices.
Today, handset manufacturers including Nokia, Ericsson, Sony, HTC and Sendo have chosen the OMAP architecture as well as software and OS developers including Symbian, Microsoft and Sun Microsystems.
In a separate agreement, TI has licensed the ARM9E Jazelle extensions.
These extensions enable enhanced performance of Java technology-based multimedia applications used in 2.5 and 3G wireless appliances.
TI and ARM have a long history of collaboration in the wireless space including the licensing of cores from the ARM7, ARM9 and ARM10 microprocessor families.
This relationship has enabled both companies to enjoy significant success in the wireless market.
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