IGBT power modules offer extended service life

Skiip4, the latest IGBT intelligent power module (IPM) from Semikron, is designed to offer a longer service life than non-sintered modules and can be used in higher temperature applications.

The IPM is used in wind and solar power applications, traction applications, elevator systems and industrial drives with high outputs of between 400kW and 1.8MW.

The Skiip4 provides 33 per cent more power than the previous version in this range.

This increase in power is down to the use of a pressure contact system, an improved heat sink and IGBT4, CAL4 chip technology.

In addition, six parallel half bridges have been used at the upper power end instead of four.

In Skiip4 modules, the semiconductor chips are not soldered to the ceramic substrate but are joined using sinter technology, meaning that higher operating temperatures are possible with no compromise to - or in some cases even increased - reliability.

The sinter bond is a thin silver layer, which has a lower thermal resistance than a bond with solders.

Thanks to the high melting point of silver, premature material fatigue can be prevented.

Like its predecessors, Skiip4 is based on well-matched components: heat sink, power module, driver and protective sensors/functions.

Here, the mounting and connecting technology, which is based on a pressure system, plays a crucial role.

Customers can also opt to have burn-in tests where the IPMs are run under real operating conditions.

These tests enable premature silicon failure to be identified and the defective chips removed.

In the tests, the modules are exposed to the maximum possible junction temperature.

The solder-free pressure contact system and the integrated laminated power rails ensure homogenous current distribution.

Every IGBT and diode chip is connected to the main terminal separately, keeping the module resistance very low.

The chips are not soldered to the ceramic substrate but are joined in a sinter process.

As these modules have no base plate, the solder-free connection between DCB and heat sink is quasi-flexible, which is why the thermal cycling capability has no upper limits.

Skiip4 will be available with blocking voltages of 1,200V and 1,700V in dual-pack topologies with three, four or six parallel half bridges per IPM.

Digital signal transmission for the switching signals is the key to ensuring a very high degree of reliability and interference immunity for switching signals.

This ensures high signal integrity and interference immunity.

Transmission depends on component parameters, is highly robust and not sensitive to temperature fluctuations or ageing effects.

The switching and sensor signal transmission channels feature galvanic isolation, meaning the user does not have to provide additional isolation.

The Skiip4 IPM also features a multi-stage output stage, which ensures the reduction of over-voltage and includes various other protective functions.

A diagnosis channel is available for optimum evaluation on the customer side.

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