Product category: Communications ICs (Wireless)
News Release from: NXP (formerly Philips Semiconductors) | Subject: SmartMX passport chips
Edited by the Electronicstalk Editorial Team on 6 September 2006
High-security chip set for US passports
NXP's SmartMX passport chip solutions meet the ICAO BAC data security and access standard, selected for the security in new passports
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The United States Department of State has chosen NXP as one of its suppliers of secure semiconductor technology for its new electronic passport (e-passport) programme. The new passports, designed to enhance border security and to facilitate international travel of US citizens, contain secure contactless smart chip technology inside the cover.
They can be scanned at authorised passport control points to speed the authentification process and increase security.
The new e-passports will be rolled out across the USA by the end of the first quarter of 2007.
The new US passport is similar to today's passport with the addition of a small contactless smart chip.
The chip securely stores the same data visually displayed on the photo page of the passport, and will also include a digital photograph.
The photograph enables biometric comparison to ensure that the bearer of the passport is the person to whom it was issued by his or her government.
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The new passport will also incorporate additional anti-fraud and security features to further enhance national security.
The State Department has also included a number of features to address privacy issues and to ensure the safe-keeping of information.
The read range of the contactless smart chip is only a few centimetres and special shielding material has been built into the cover to prevent communication with the chip while the cover is closed.
In addition, the ICAO (International Civil Aviation Organisation) basic access control (BAC) standard is used to prevent skimming and eavesdropping (attempts to read the contactless high frequency communication between the passport chip and the reader device at the border control station).
These combined features will mitigate the potential for unauthorised reading of the e-passport.
NXP has achieved more than 80% of all smart passport implementations globally.
Thirty countries including the USA have selected the secure, contactless smart chip technology from NXP.
Other countries using NXP technology include Austria, France, Germany, New Zealand and Singapore.
For the US e-passport programme NXP is supplying its chip technology to the smart card manufacturer Gemalto, which has the overall lead for providing secure smart card packages for the e-passports.
Gemalto's package was recently selected by the State Department for final test and evaluation, a precursor to volume orders and issuance to the US public.
'Security, performance and reliability are the key factors for e-passport programme consideration', said Frans van Houten, President and CEO, NXP.
'The selection by the US State Department and 29 other national governments around the globe is a strong endorsement of our global leadership in this semiconductor segment, and we look forward to long-standing relationships in delivering this important technology'.
NXP's SmartMX passport chip solutions meet the ICAO BAC data security and access standard, selected for the security in new passports.
The BAC standard prevents illicit reading of e-passports by requiring that the passport be physically open and presented to an authorised reader at a customs border crossing point.
The official must first scan the machine readable zone (MRZ) of the passport, obtaining a key that authenticates the passport contactlessly, and only then transmits the passport holder's information via a secure, encrypted communication.
NXP SmartMX passport chips have received the highest level of security certification awarded to secure smart IC solutions available - the Common Criteria EAL5+ certification by the German Federal Office of Information Security.
It fully supports and even exceeds the specifications for smart passports set by the International Civil Aviation Organisation (ICAO).
The high-performance chip features NXP's unique ultra-low-power handshaking technology, enabling an exceptional operating range by fully meeting the ISO/IEC14443 standard power range requirements.
The experience of over 700 millions contactless NXP modules in the market is the basis for the expertise on contactless IC applications.
The 72Kbyte EEPROM high-security chip is specifically designed to fulfil the needs of e-government projects, with its high memory capacity able to hold biometric information such as fingerprints and facial images.
Additionally, the IC is highly reliable, with a data retention time of 20 years that doubles the industry standard.
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