Slimline filters protect against EMI and ESD

Breakthrough EMI filters provide the industry's highest level of ESD protection in ultrathin leadless packages.

NXP has developed breakthrough EMI filters featuring the industry's highest level of ESD protection - +/-30kV contact - available in NXP's award-winning ultrathin leadless package (UTLP).

With a height of only 0.5mm and a pad pitch of 0.4mm, the IP4253 and IP4254 are also among the thinnest EMI filters available on the market today.

The ultrathin, ultrarobust electromagnetic interference filters are designed for portable applications such as mobile phones, PDAs, MP3 players and GPS navigators featuring ultraslim designs.

"Thin handsets are 'in' - and they will continue to become thinner - as consumers embrace the fashion, portability and longer battery life of ultra-slim mobile devices", said Frans Scheper, General Manager, General Application Discretes Business Line, and Senior Vice President, NXP Semiconductors.

"With the NXP IP4253 and IP4254 series in UTLP, handset manufacturers can take advantage of the ultracompact EMI filters which vastly reduce the size of the PCB and double the level of integrated ESD protection available for their thinnest handset designs".

"For consumers, this means more brilliant displays and higher sound quality on the slimmest and most stylish handsets".

With so much functionality available in mobile multimedia devices - from radio, Bluetooth and MP3 music playback to high-resolution LCDs, video cameras and TV-on-mobile - the RF transceiver in the handset interferes with more interfaces, making a higher degree of EMI filtering essential.

Further, the core ICs in mobile multimedia devices also require a higher level of protection from electrostatic discharge, since they are manufactured using smaller process technologies to enable a higher level of integration.

By delivering high-quality EMI filtering with the industry's highest ESD protection - +/-30kV contact, or twice the level previously available - the NXP IP4253 and IP4254 EMI filters address a critical need in the market today.

The NXP IP4253 and IP4254 series of EMI filters in UTLP offer a 90% space reduction compared with alternative discrete technology.

With a pad pitch of only 0.4mm, the IP4253 and IP4254 in UTLP enable a space reduction of more than 30% compared with alternative solutions in a 0.5mm pitch size.

The breakthrough in ultrathin EMI filters is enabled by the UTLP platform developed by NXP.

The NXP UTLP platform - winner of the 2006 Hong Kong Award for Industries: Technological Achievement Award - gives designers the flexibility to add more functionality into smaller spaces in consumer electronics products, through a patent-pending substrate and etching technology.

UTLP increases the "silicon to plastic" ratio and offers less parasitic capacitance and inductance compared with other plastic packages, due to shorter wire length and internal traces, making it ideally suited for high-frequency applications.

Other NXP products currently available in UTLP include the IP4221CZ6-XS ESD protection chip, which features a record 0.35mm pitch.

The IP4253 and IP4254 EMI filters in UTLP are available immediately in four-, six- and eight-channel configurations, each with component values of 15pF-100ohm-15pF and 15pF-200ohm-15pF.

Production quantities are fully available in a fully RoHS compliant, lead-free version, as well as a green package version without halogens in the plastic.

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