Product category: Analogue and Mixed Signal ICs
News Release from: National Semiconductor | Subject: LMV1032
Edited by the Electronicstalk Editorial Team on 16 June 2004
Audio amp is first in ultrathin package
National Semiconductor reckons it has developed the world's thinnest IC packaging.
National Semiconductor reckons it has developed the world's thinnest IC packaging As thin as four sheets of office paper, National products in these new micro SMD and leadless leadframe packages enable original equipment manufacturers to build smaller, thinner and lighter cellphones, displays, MP3 players, PDAs and other devices
This article was originally published on Electronicstalk on 5 Jan 2001 at 8.00am (UK)
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The new 0.4mm ultrathin packages are available today in National's analogue amplifier products; they will be available in the second half of 2004 for National's wireless products.
The company also plans to offer ultrathin chip packages for its portable power products.
National's new package types are available with traditional tin-lead or state-of-the-art lead-free interconnect options.
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"National's ultrathin package technologies provide immediate benefits for consumers", said Kamal Aggarwal, Executive Vice President, Central Technology and Manufacturing Group, National Semiconductor.
"National products allow our OEM customers to differentiate their products by enabling the smallest, thinnest, most lightweight devices on the market".
"Using National Semiconductor's amplifier products in ultrathin packages, BSE is able to create higher sensitivity microphones that significantly improve audio performance and reduce size", said Dan C Song, Chief Technology Officer with BSE Corp, a leading Korean microphone manufacturer.
"National's ultrathin products are ideally suited for applications such as mobile phones and other communications devices".
Developed by National engineers in Santa Clara, California and Melaka, Malaysia, these latest ultrathin packages may be used by OEMs with conventional surface-mount handling equipment.
National's new packages use advanced manufacturing processes for making silicon, bumping technologies, back-grinding, leadframe design and wire-bond technology.
"Over the last four years, National has patented several innovative designs and processes that reduce the thickness of its packages by 60%", said Sada Patil, Director, Package Technology Group.
Packaging is a critical part of the semiconductor manufacturing process.
National produces billions of chips per year and packages them in more than 70 different types of packages.
National has more than 260 patents in package technologies, and receives approximately 30 new packaging patents per year.
National has led the market in packaging innovations for years with the introduction of revolutionary micro SMD and leadless leadframe packaging (LLP) technologies.
National's micro SMD chip-scale package is available in 4- to 36-bump-count packages.
National's LLP packages are available in 6-to 80-lead package types.
Micro SMD and LLP packages offer OEMs the advantages of small footprint, improved electrical, thermal and moisture sensitivity, reduced noise and easier board assembly.
During 2004, National plans to introduce even thinner 0.3 and 0.2mm package types, with bump counts up to 100.
The LMV1032 is National's new ultrathin audio amplifier series for small-form-factor electret microphones designed to replace the junction field effect transistor (JFET) preamp currently in use.
The addition of a third pin in electret microphones that incorporate the LMV1032 allows for a dramatic reduction in supply current compared to JFET-equipped electret microphones.
The LMV1032 series is ideal for extended battery life applications, such as digital cameras, MP3 players.
Microphone supply current is reduced to 60uA, assuring longer battery life.
The LMV1032 series is guaranteed for supply voltages from 1.7 to 5V, and has fixed voltage gains of 6, 15 and 25dB.
It also offers low output impedance over the voice bandwidth, excellent power supply rejection (PSRR), and stability over temperature.
The devices are offered in space saving four-bump ultrathin micro SMD lead free package.
National also introduced the LMV1012UP, an ultrathin version of its popular "amp-in-a-mic" product.
The new LMV1012UP is the market's first amplifier in a microphone integrated directly inside two- and three-wire electret condenser microphones (ECMs).
These amplifiers replace JFETs for longer battery life and greater noise immunity, resulting in better microphone performance.
These products are ideal for use in microphones in mobile handsets, headset accessories and other portable microphone applications.
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