Product category: Communications ICs (Wireless)
News Release from: Zarlink Semiconductor | Subject: MGCM02 and MGCT04
Edited by the Electronicstalk Editorial Team on 16 July 2001
Chipset saves space, cuts costs for TDMA
handsets
Zarlink Semiconductor has announced a new highly integrated RF chipset for cellular handsets operating in dual-mode TDMA/AMPS networks.
Zarlink Semiconductor (formerly Mitel Semiconductor) has announced a new highly integrated RF chipset for cellular handsets operating in dual-mode TDMA/AMPS networks that are installed primarily in North America The MGCM02 and MGCT04 devices offer handset manufacturers a complete IF receiver, baseband interface and transmitter in a two-chip solution that slashes board area by 60% and cuts costs by 30% compared with competitive products
This article was originally published on Electronicstalk on 7 Feb 2001 at 8.00am (UK)
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A global manufacturer is already using Zarlink's integrated design in a digital TDMA and analogue AMPS dual-band, dual-mode handset that starts shipping this summer.
Other major manufacturers are also evaluating the devices.
"Reducing the size and cost of components in cellular handsets are key factors in this competitive consumer market", said Derek Rye, marketing manager, cellular products, Zarlink.
"We worked closely with lead customers to design and develop this chipset as the most integrated and cost-effective digital cellular solution available".
Demand for multimode handsets is expected to be strong as carriers begin rolling out overlay networks that add GSM capabilities to TDMA/CDMA networks.
The MGCM02 is an IF receiver and baseband interface chip.
The device integrates Zarlink's existing MGCR01 IF receiver and MGCM01 baseband interface chips into a single 49-pin BGA package measuring just 7 x 7mm.
The new MGCT04 transmit circuit provides the transmit function in dual-band, dual-mode TDMA/AMPS and CDMA/AMPS mobile telephones.
The chip is designed into a 5 x 5mm MLF package.
The MGCM02, when combined with the MGCT04, provides IF receiver, baseband interface and transmitter functionality in just 75mm2 of board space, compared with 200mm2 required by competitive solutions.
The new packaging also improves performance by reducing unwanted characteristics such as stray capacitance and inductance.
The MGCM02 and MGCT04 are now sampling.
The chipset is priced at about US $5.00 in high volumes.
To support customer evaluation and ease of design, Zarlink offers an evaluation board featuring both devices, plus a reference design.
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