Product category: Electronics Manufacturing Machinery and Materials
News Release from: Metcal | Subject: VPI-1000 optical inspection system
Edited by the Electronicstalk Editorial Team on 23 September 2002
Upgraded optical inspection
system looks better
Metcal has made three significant enhancements to its ground-breaking VPI-1000 optical inspection system
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This next generation unit for inspecting the hidden joints of area packages now offers new tips that can negotiate between components only 0.7mm apart, an optional holder for boards measuring up to 305 x 305mm, and enhanced user-friendly software that eliminates the need for calibration. The VPI-1000 uses endoscope technology to see under array packages that have been placed and soldered onto a PCB.
Its innovative design means that it is the only system able to visually inspect components with standoff heights as low as 0.05mm while providing clear, crisp images magnified up to 245x.
The MT2 tips are ideal for use on compact boards featuring high densities of advanced array packages, such as BGAs, CSPs and LGAs.
The new tips can negotiate between components only 0.7mm apart, or half the distance of a standard tip, allowing even the most demanding of assemblies to be inspected.
Using the optional board holder increases the size of boards that can be handled up to 305 x 305mm.
The use of array packages continues to expand into applications featuring larger boards, such as the medical and telecomms markets, making this an important addition to the VPI-1000.
Further reading
Optical inspection system takes on larger boards
A new highly versatile and flexible optical inspection system can be used on large boards measuring up to 914 x 914mm
Distribution deal expands German exposure
Metcal has appointed Peter Jordan to distribute its hand soldering, rework, repair, optical inspection and fume extraction systems in Germany
Rework system expands to handle bigger boards
The APR-5000-XLS array package rework system uses a single reflow/placement head and a stationery PCB centred over an enhanced, dual-zone pre-heater capable of handling both large and small boards
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Metcal will exhibit its APR-5000 array package rework system at Nepcon UK, Brighton
The handler simply attaches the board holder to the unit's built-in x-y table, which offers variable height adjustment from 12.7 x 83.82mm.
Completing the latest round of innovations is the new look software and user-friendly interface.
Already well received, this latest update completely eliminates the need for calibration, as this function is preset within the system.
The existing software was designed to help users get the most from the system without the need for extensive and expensive training, and with the latest update setup is even easier than before.
Metcal's VPI-1000 offers a cost-effective alternative to X-ray inspection that is both simpler to use and able to detect a wider range of defects.
The unit can be used to detect faults such as bridging, cold solder joints, open circuits, excess flux contamination, and all other commonly occurring defects that show up only as a visual imperfection.
In use, the metal halide light source floods the underside of the component in bright white light, and a 12.7mm CCD camera feeds high-resolution colour images to a flat LCD monitor.
Featuring an endoscopic lens with mirrored tip that can be rotated by 90 degrees (left/right) and 5 degrees (up/down) to provide optimum inspection of the upper and lower joints on both the exterior and interior joints of the component.
"Optical inspection allows users to perform real diagnostics on high density, array package boards", said Graham Ross, Global Product Manager, Optical Inspection Systems for Metcal.
"It not only tells you the problem, but also how to change your process, because it enables you to actually see what's going on".
"The VPI-1000 offers a cost effective, easy to use system and with these latest additions we are pushing back the boundaries of optical inspection even further than before".
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