Product category: PCB Assembly Equipment and Tools
News Release from: Metcal | Subject: APR-5000-XLS
Edited by the Electronicstalk Editorial Team on 15 July 2003
Rework system expands to handle bigger
boards
The APR-5000-XLS array package rework system uses a single reflow/placement head and a stationery PCB centred over an enhanced, dual-zone pre-heater capable of handling both large and small boards.
When it was unveiled in 2001, Metcal's APR-5000 array package rework system established a new standard in repeatability, accuracy and thermal control Now Metcal has developed the APR-5000-XLS array package rework system for large-to-small printed circuit boards; again setting the benchmark for the precise, cost-effective rework of the widest range of component types, including today's leading-edge BGA, CSP, land grid array (LGA), micro SMD, micro-lead frame (MLF) and bumped chip component packages
This article was originally published on Electronicstalk on 17 Oct 2001 at 8.00am (UK)
Related stories
Smart route to lead-free hand soldering
Switching to lead-free hand soldering need not demand new soldering equipment or processes thanks to an established iron technology from Metcal.
The hidden costs of hand soldering
Today's electronics manufacturing and rework place tight demands on the humble soldering iron.
The APR-5000-XLS is capable of handling boards 610 x 610mm in size an