Product category: Electronics Manufacturing Machinery and Materials
News Release from: Metcal | Subject: APR-5000
Edited by the Electronicstalk Editorial Team on 14 April 2003
Seaside showing for
array package rework system
Metcal will exhibit its APR-5000 array package rework system at Nepcon UK, Brighton
The APR-5000 array package rework system is an advanced, versatile system offering the repeatability, accuracy and thermal control essential for the safe and effective rework of today's leading-edge BGA, CSP, land grid array (LGA), micro SMD, micro-lead frame (MLF) and bumped chip component packages.
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Capable of handling boards up to 203 x 254mm with a placement accuracy to 0.0254mm and interconnection pitches as low as 0.3mm, the APR-5000 array package rework system is ideal for reworking smaller PCBs such as cel phones and laptop computers.
With such assemblies characterised by small, odd shaped boards and advanced packages, the APR-5000 array package rework system delivers the high-end performance required by these products at a very competitive cost.
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