Product category: Microprocessors, Microcontrollers and DSPs
News Release from: LSI Europe | Subject: RapidChip G90
Edited by the Electronicstalk Editorial Team on 30 June 2005
Platform ASICs move
to 90nm process technology
LSI Logic Corporation has announced plans for its next-generation RapidChip platform ASIC families to be manufactured in the company's G90 90nm process technology
The new slices will provide system designers with the maximum integration and performance benefits of 90nm technology, along with the fast time to market, reduced nonrecurring and reduced engineering costs of the RapidChip platform ASIC technology. The RapidChip G90 families will allow designers to take advantage of the features of platform ASIC technology for use in a broad base of systems including communications, storage, industrial, medical, defence and high-end consumer applications.
This article was originally published on Electronicstalk on 30 June 2005 at 8.00am (UK)
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The RapidChip G90 families offer a range of gate counts, memory resources, I/Os, PLLs and high-speed serialiser/deserialiser (serdes) to support a broad range of customer applications.
Some of the RapidChip G90 features include: useable gate counts of up to 10 million ASIC gates; up to 20Mbit of diffused MatrixRAM; a seamless memory hierarchy with flexible RCell memory and high density MatrixRAM providing maximum flexibility to support customer memory needs; up to 64 channels of integrated 8.5Gbit/s serdes; performance up to 500MHz; support for newest industry standard serial interfaces such as PCI Express (5Gbit/s), FibreChannel (8.5Gbit/s), Serial RIO (6Gbit/s), SATA/SAS (6Gbit/s), Hypertransport 2.0 (2Gbit/s), Gigabit Ethernet, XAUI and SPI4; Landing Zone processor support for industry standard ARM, MIPS and ZSP architecture cores operating at up to 400MHz; industry-leading parallel memory interface support up to 400MHz/800Mbit/s (DDR2); memory interface standards including FBDIMM, DDR1, DDR2 and QDR2; and multiple standard packaging options as well as custom designed flip chip plastic ball grid array (FPBGA) packages.
LSI Logic also offers a seamless migration from the RapidChip 90nm technology to the company's proven cell-based technology for high volume applications.
This seamless migration path is possible because the process technology, intellectual property, advanced packaging etc are common between RapidChip platform ASIC and the company's cell-based ASIC technology.
'This RapidChip offering will deliver the highest performance and density available in a platform based solution today', said Rich Brossart, Vice President, Technology Marketing, LSI Logic.
Further reading
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An all-new line of embedded modem products includes a pin-compatible family of data and fax modem chipsets and a single package monolithic data access arrangement
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New generation of advanced communication processors will enable network equipment designers to provide high-bandwidth and real-time services
LSI releases sluggish Q1 results
Chip maker's first quarter results show reduced revenue compared with last year's figures
'Our unique offering will allow designers to take advantage of the performance gains provided by 90nm while minimising NRE investment and achieving an optimum balance of risk, performance and turnaround time for a wide range of innovative designs'.
In a newly released report titled 'Structured ASICs, designing for the future' (April, 2005), Senior Analyst Jerry Worchel of In-Stat ranked LSI Logic as the most successful of all platform (or structured) ASIC suppliers.
The report went on to say: 'To this point in time, LSI Logic has been the most successful of all structured ASIC suppliers'.
'While change is inevitable, in the case of LSI Logic's leadership position, we do not expect to see change for several years'.
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