Innovative Silicon enhances Z-Ram technology
Innovative Silicon, the developer of the Z-Ram zero-capacitor floating body (FB) memory technology has announced two enhancements to the Z-Ram technology.
Bit-cell operating voltage has been reduced to less than 1V.
The company claimed that this makes it the industry's lowest-voltage FB memory bit cell and the first to be on-par with traditional DRAM voltages.
Z-Ram technology is now constructed on bulk silicon - without the requirement for expensive silicon on insulator (SOI) substrates - by using the 3D transistor structures preferred by major DRAM manufactures.
With these enhancements, which have been substantiated on a test chip manufactured by Hynix Semiconductor, Innovative Silicon has demonstrated that the Z-Ram technology is the only DRAM memory replacement technology that is lower-cost than traditional DRAM at the latest sub-40nm nodes.
Moreover, the Z-Ram technology can meet DRAM requirements for low power consumption, low-voltage operation, and the latest Double Data Rate (DDRx) performance levels.
Not what you're looking for? Search the site.
Browse by category
-
Active components (13681)
- Analogue and mixed-signal ICs (2141)
- Communications ICs (wired) (2083)
- Discrete power devices (457)
- Programmable logic devices (632)
- Microprocessors, microcontrollers and DSPs (2621)
- Memory devices and modules (817)
- Power-supply ICs and controllers (2951)
- Communications ICs (wireless) (1802)
- Standard logic devices (173)
- Passive components (3639)
- Design and development (10279)
- Enclosures and panel products (4035)
- Interconnection (3703)
- Electronics manufacturing, packaging (3506)
- Industry news (2108)
- Optoelectronics (1981)
- Power supplies (3058)
- Subassemblies (5681)
- Test and measurement (5836)