Wafer bumping approved to automotive standards: News from IC Interconnect

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Wafer bumping service company IC Interconnect has successfully completed its registration audit for ISO/TS16949:2002 and 9001:2000. This standard encompasses the American (QS9000), German (VDA6.1), French (EAQF) and Italian (AVSQ) automotive quality standards. 'We are proud to be one of the first wafer bumping services companies to pass these quality systems audits'.

'Compliance to this set of standards demonstrates ICI's commitment to our customers and the discipline to provide the highest quality service today and in the future', says Jim Cuccio, Quality/Systems Manager of IC Interconnect.

The International Standards Organisation is a worldwide federation of national standards bodies, one from each of 130 countries.

ISO promotes the development of standardisation and related activities in the world to better facilitate international trade and cooperation.

ISO's work results in international agreements which are published as international standards.

'Attaining this certification allows IC Interconnect to maintain competitiveness in a global playing field'.

'It also shows IC Interconnect's current and potential customers, the company's commitment to manufacturing system disciplines', says Curt Erickson, President of IC Interconnect.

'Our customers expect the highest quality and performance from ICI'.

'This certification assures them that their requirements will be met'.

In addition to the ISO standards certification, IC Interconnect invests in state-of-the-art equipment and a knowledgeable staff to provide customers with high-quality wafer-bumping services.

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News Release from: IC Interconnect Edited by the Electronicstalk Editorial Team on 6 May 2005

Wafer bumping approved to automotive standards

Wafer bumping service company IC Interconnect has successfully completed its registration audit for ISO/TS16949:2002 and 9001:2000.

Note: Readers of the Editor’s free email newsletter will have read this news when it was announced. . It’s free!

News Release from: IC Interconnect
Edited by the Electronicstalk Editorial Team on 6 May 2005