Pad resurfacing process uses less gold: News from IC Interconnect

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IC Interconnect's Ni/Au pad resurfacing process for high-temperature wire bond applications produces bonds that are stable at high temperatures with a thinner gold layer. These special high-temperature wire bonds are especially useful in avionics and automotive applications, and require no additional lead time for production. IC Interconnect's process eliminates the Kirkendall voiding that takes place in an Al/Au interface at 200C thermal exposures.

IC Interconnect's process is proving to be highly successful.

IC Interconnect normally uses a 0.1um thick gold layer where other companies require at least 1um of gold or thicker.

'Many people don't believe that a thinner gold layer can hold up to the stress and abuse caused by their application', says Christine Jauernig, Process Engineer for IC Interconnect.

'Products made with our Ni/Au process have been tested and qualified by several customers'.

Nickel/gold pad resurfacing also provides many benefits for copper-based ICs.

To avoid Cu corrosion in plastic packaging, there are two solution paths - aluminium plating on copper pads, which is very expensive, or nickel/gold plating on copper pads.

The second option is maskless, avoiding the costs associated with thin film sputter, photolithography and metal etch.

'Electroless Ni/immersion Au is an inexpensive method to enable standard gold wire bonding to be extended to the thermal demands (200C) required of today's state-of-the-art electronics', says Curt Erickson, President of IC Interconnect.

This application contributes to IC Interconnect's already extensive list of qualifications for manufacturing for automotive, aerospace and other high-reliability applications.

The company is currently ISO/TS16949.

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News Release from: IC Interconnect Edited by the Electronicstalk Editorial Team on 20 October 2005

Pad resurfacing process uses less gold

IC Interconnect's Ni/Au pad resurfacing process for high-temperature wire bond applications produces bonds that are stable at high temperatures with a thinner gold layer.

Note: Readers of the Editor’s free email newsletter will have read this news when it was announced. . It’s free!

News Release from: IC Interconnect
Edited by the Electronicstalk Editorial Team on 20 October 2005