Product category: Microprocessors, Microcontrollers and DSPs
News Release from: GD Technik | Subject: Atmel AVR microcontrollers
Edited by the Electronicstalk Editorial Team on 3 November 2003
Microcontrollers strip down
to save space
In addition to the current standard packages, Atmel's popular AVR microcontrollers can now be supplied in a chip scale micro lead-frame package and as a bare die
In addition to the current standard packages, Atmel's popular AVR microcontrollers can now be supplied in a chip scale micro lead-frame (MLF) package and as a bare die. These new packaging alternatives drastically reduce development costs, design time and ultimately production costs, by allowing hardware designers to reduce the area of their design to a fraction over those previously used.
This article was originally published on Electronicstalk on 3 November 2003 at 8.00am (UK)
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Kim Allen, GD Technik's Product Marketing Manager says: 'With the introduction of the highly integrated Atmel AVR 8bit Flash microcontrollers in the MLF package and in die form, system designers can now use this technology in space critical applications.
This combined with the high performance of AVR microcontrollers, enables designs previously requiring several integrated circuits to be packaged into an area as small as the die itself, and without the need for expensive tooling to handle it'.
There are three different versions of the MLF package available: 5 x 5mm 32-pad package, 7 x7mm 44-pad package and 9 x 9mm 64-pad package.
Despite the very small size of the MLF package, standard equipment for surface mount devices can be used.
With the small size supported by a generous ground pad under the package, devices packaged in this technology have extremely good electrical characteristics.
Atmel's die alternatives can be delivered either as a whole wafer, or as sawn die in waffle pack.
Using the parts in die form will give the smallest size and the lowest profile of the product.
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