Product category: Design and Development Software
News Release from: Fluent | Subject: Icemax 2.2
Edited by the Electronicstalk Editorial Team on 18 April 2006
Package analysis expands
to next-generation ICs
Fluent has released a new version of its Icemax software, claimed to be the world's fastest circuit extraction tool for analysing advanced IC package designs
The new version of the Icemax solver comes with 64bit OS support, practically eliminating the limit on the complexity of electrical models that can be generated. As the packaging industry gets ready to meet the challenges of next-generation packaging technologies, including system-in-package (SiP), package-in-package (PiP), package-on-package (PoP) etc, the 64bit version of Icemax will prove to be an invaluable addition in design flows.
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Customers will no longer be restricted by the memory limitations intrinsic to 32bit operating systems.
'Icemax is already well-known in the semiconductor industry worldwide for its speed, ease of use and seamless ability to import package layouts in standard industry formats', says Rajesh Nair, Product Manager, Fluent's Ice Division: 'With Icemax 2.2, our customers will experience computational performance that Fluent is recognised for and is unmatched in the industry today'.
'Computations that take days in other tools can now be completed in a few hours'.
Further reading
Upgrade for EMI analysis
The latest version of Icewave incorporates enhanced model building capabilities and radiation computation for EMC/EMI analysis of electronic systems
'To meet the stringent product development cycles in today's IC packaging industry, Icemax continues to be the only viable solution'.
Icemax 2.2 also comes with several industry-leading breakthrough improvements in the following areas.
Advanced geometry cleanup schemes minimise the number of facets describing the design, ultimately leading to smaller model sizes.
A new and improved 'hybrid' mesh (consisting of triangles and quadrilaterals) gives a much smaller cell count than traditional triangular meshing schemes employed in other electrical modelling tools.
Optimised integration schemes generate accurate solutions without excessive mesh refinement.
A 'Halo-based' proximity detection algorithm provides capacitance parameter extraction, eliminating unnecessary geometric features from the capacitance model.
Multiple-CPU support for RLC computations allows solution times to scale based on the number of CPUs.
All these enhancements allow accurate solutions to be generated faster and with far less memory requirement than earlier releases of Icemax.
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