Product category: Design and Development Software
News Release from: Fluent | Subject: Ansys Icemax
Edited by the Electronicstalk Editorial Team on 08 March 2007
Software advances IC package design
Release provides IC package designers with a flexible modelling environment to set up and analyse a wide range of system-in-package designs.
Ansys has announced the release of version 3.0 of its Ansys Icemax software for circuit extraction of advanced integrated circuit (IC) package designs This new release provides IC package designers with a flexible modelling environment, to set up and analyse a wide range of system-in-package designs, including package-on-package, package-in-package and package-on-PCB structures
This article was originally published on Electronicstalk on 1 Nov 2002 at 8.00am (UK)
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