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Product category: Microprocessors, Microcontrollers and DSPs
News Release from: eASIC Corp | Subject: Nextreme
Edited by the Electronicstalk Editorial Team on 30 January 2007
Structured ASICs fit in
system-in-package design
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Japanese researchers selected eASIC's Nextreme family of 90nm structured ASIC devices for a unique system in package product.
Fukuoka Intelligent Cluster Laboratory for Emerging and Enabling Technology of SoC (FLEETS) selected eASIC's Nextreme family of 90nm structured ASIC devices for its unique system in package (SiP) product eASIC delivered to FLEETS on time the Nextreme product in both bare dice and packaged devices modes
This article was originally published on Electronicstalk on 5 Jan 2007 at 8.00am (UK)
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