Product category: Heatsinks and Thermal Management
News Release from: The Bergquist Company | Subject: Sil-Pad 1100ST
Edited by the Electronicstalk Editorial Team on 3 October 2006
Thermal interface material
sticks to its task
Glass-fibre-reinforced silicon-based thermal interface material is designed specifically for high-volume automatic dispensing applications
The latest Soft Tack product from the Bergquist Company is Sil-Pad 1100ST, which features inherent tack on both sides and dual liners for easy placement and exceptional thermal performance (thermal impedance is 4.26C-cm2/W at 3.5kg/cm2). Sil-Pad 1100ST is a glass-fibre-reinforced silicon-based thermal interface material designed specifically for high-volume automatic dispensing applications.
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The IsoEdge range of heatsink products can improve component packaging densities, reduce parts counts and cut the assembly costs of a wide range of electronic products
Typical applications include automotive ECMs, power supplies, motor controls and any electronic power device that needs a thermal interface with its heatsink.
The product is ideal for low mounting pressure applications, delivering exceptional thermal performance with easy assembly.
Sil-Pad 1100ST's inherent tack eliminates the need for additional adhesive layers so that dispensing is made easier and interfacial resistance remains low.
The tack also facilitates assembly, as the material is repositionable on the target surface without the quality problems often associated with other PSA-coated products.
Sil-Pad 1100ST is therefore a complete thermal management solution, ideal for automated production processes.
Sil-Pad 1100ST is available in sheets, rolls or die-cut pieces of any shape or size, with a standard thickness of just 0.305mm.
Standard sheet size is 304.8 x 304.8mm and the standard roll size is 304.8mm x 76.2m.
Custom thicknesses, sizes and die-cut shapes are available on request.
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