Plastic and aluminium enclosures and housings

Product category: Electronics Manufacturing Machinery and Materials
News Release from: The Bergquist Company | Subject: Gap Pad Sil-Free 1000
Edited by the Electronicstalk Editorial Team on 23 December 2003

Bridge that gap without silicone

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A new silicone-free, thermally conductive and electrically isolating gap filling material is designed for use in applications where silicone could contaminate key manufacturing processes

A new silicone-free, thermally conductive and electrically isolating gap filling material from The Bergquist Company is designed for applications where silicone could contaminate key manufacturing processes such as solder reflow and/or cleaning. Gap Pad Sil-Free 1000 is especially suitable for silicone-sensitive applications such as disk drives, open circuit relays, and electromechanical components including brush motors and switches.

Gap Pad Sil-Free 1000 is one of the softest, most compliant, and conformable thermally conductive, silicone-free gap filling materials currently available.

With a thermal conductivity value of 1W/mK, the material offers good heat transfer for high-power-density applications.

The material features an asymmetrical laminate construction with a thin, low-tack rubber coating on one side of an embedded glass reinforcement, and a naturally tacky gap-filling rubber on the other.

This ensures ease of pad placement into vertical positions during assembly processes.

The embedded reinforcement allows customers to easily pull the part off the liner and place the pad in position in the application.

Gap Pad Sil-Free 1000 is available in sheet form or as die-cut parts.

Standard thicknesses are 0.015, 0.020, 0.040, 0.060, 0.080, 0.100 and 0.125in (0.38, 0.51, 1.02, 1.52, 2.03, 2.54 and 3.12mm).

Custom thicknesses are also available.

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