Week 8 July - 14 July 2007
Showing 1 - 10 of 98 articles
Ball bonder emulates wedges
Wedge emulation technology makes a ball bonder a viable and flexible alternative to a wedge bonder.
News from Palomar Technologies, 13 July 2007
Front end supplies meet current demands
Rack-mount front ends are designed for applications requiring several high-current rails and can provide up to 80A on a single output.
News from Power-One, 13 July 2007
FPGA board speeds wideband sensor development
User Application Article
S2 Corp is using the Nallatech BenADC 3G COTS FPGA board in the development and testing of a new generation of ultrawideband sensor technology.
News from Nallatech, 13 July 2007
Ethernet controller takes on TCP/IP processing
Memory-mapped hardware TCP/IP device provides ready-made Internet capabilities at full speed with no need for additional PHY layer ICs.
News from Saelig Company, 13 July 2007
FET and driver combine for compact power
Optimised and integrated FET plus driver power stage solution replaces discrete alternative to save more than 80% of PCB real estate.
News from Fairchild Semiconductor, 13 July 2007
Extended cover keeps USB drives sealed
A new extended cover option for USB Buccaneer connectors allows industrial Flash drive sockets to maintain IP68 sealing when the drive is in place.
News from Bulgin Components, 13 July 2007
Further information availableMemory technologies come together
NOR, NAND and RAM combine in a single-bus single-package solution that offers a completely managed memory subsystem in a 10 x 13 x 1.4mm LBGA package.
News from Silicon Storage Technology, 13 July 2007
VME64 card combines dual-core processor with FPGAs
Rugged COTS DSP processing card combines a Freescale MPC8641D processor, two Xilinx Virtex-5 FPGAs and a VXS based high-speed serial interconnect fabric.
News from Vmetro-Transtech, 13 July 2007
LCD monitor eases display integration
Open-frame 8.4in LCD monitor comes with an integral VGA interface, touch screen capability and built-in audio and composite video options.
News from BVM, 13 July 2007
Clean room caters for custom assembly
A new clean room at its Minneapolis manufacturing plant will allow Omnetics to expand its custom interconnect business.
News from Omnetics Connector Corp, 13 July 2007
Not what you're looking for? Search the site.
Featured articles
- Schroff Card-Lok can be compressed from both ends
The Series 236 Card-Lok from Schroff incorporates a dual-thread design that allows the device to be compressed from both ends by turning a single screw. - Linear unveils triple-output DC/DC uModule
Linear Technology has introduced the LTM4615, a complete triple-output DC/DC uModule regulator system.
Browse by category
- Active components (13556)
- Passive components (3584)
- Design and development (10248)
- Enclosures and panel products (3983)
- Interconnection (3643)
- Electronics manufacturing, packaging (3484)
- Industry news (2106)
- Optoelectronics (1959)
- Power supplies (3009)
- Subassemblies (5623)
- Test and measurement (5784)
