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Product category: PCB Assembly Equipment and Tools
News Release from: Palomar Technologies | Subject: Model 8000
Edited by the Electronicstalk Editorial Team on 13 July 2007
Ball bonder emulates wedges
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Wedge emulation technology makes a ball bonder a viable and flexible alternative to a wedge bonder.
Palomar Technologies has developed novel wedge emulation technology for low-profile interconnects, fine-pitch running-stitch interconnects, and die-to-die bonding in high-density packages such as LEDs and RF devices Wedge emulation uses Palomar Technologies' Model 8000 ball bonder to maximise the bonding speed, reliability, and reduced keep-out space of a ball bonder for high density packages that previously required a wedge bonder