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Product category: IC and Hybrid Processing Equipment
News Release from: Engis (UK) | Subject: SM lapping machines
Edited by the Electronicstalk Editorial Team on 23 November 2004
More control for wafer polishing
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Engis has launched its new SM lapping machine to provide increased productivity to a wider group of users.
Responding to customer demand for full CMP kinematics in an affordable wafer polishing/planarising machine, Engis has launched its new SM lapping machine to provide increased productivity to a wider group of users Available in 14 and 20in plate size models, the machines are built to SEMI S2 standards and provide independent variability for speed, direction, time, oscillation rate and oscillation speed