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Heatsinks and Thermal Management
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Softer gap filler boosts thermal performance
Material provides an industry-leading combination of specifications, including thermal conductivity, softness, robustness and ease of use, for demanding applications such as cooling laptop CPUs.
News from Bergquist Company ( 2 June 2006)
Filler bridges thermal gaps
High-performance, thermally conductive, electrically isolating, liquid gap filling material combines both an excellent conductivity of 3.6W/mK and exceptional softness.
News from Bergquist Company ( 1 May 2006)
Robinson takes charge of UK and Ireland sales
Chomerics Europe has appointed 34-year old Sam Robinson as Territory Sales Manager for the UK and Ireland.
News from Chomerics Europe (28 April 2006)
Thermal products add Turkish distribution
Aktif Neser Elektronik a specialist supplier for electronic components, test equipment and systems has been appointed by the Bergquist Company as its new representative in Turkey.
News from Bergquist Company (12 April 2006)
Heatsink software supports more devices
Forged heatsink supplier Alpha-Novatech has made its products available for download in HeatSinkDesigner format.