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Product category: Heatsinks and Thermal Management
News Release from: The Bergquist Company | Subject: Gap Pad 5000S35
Edited by the Electronicstalk Editorial Team on 02 June 2006
Softer gap filler boosts thermal
performance
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Material provides an industry-leading combination of specifications, including thermal conductivity, softness, robustness and ease of use, for demanding applications such as cooling laptop CPUs.
The Bergquist Company has extended its Gap Pad S-Class range of thermally conductive gap-filling products with the announcement of Gap Pad 5000S35 The new material provides an industry-leading combination of specifications, including thermal conductivity, softness, robustness and ease-of-use, for demanding applications such as cooling laptop CPUs, graphics processors and cards, CD-ROM drives, and voltage regulators