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    <title>Heatsinks and thermal management latest news on Electronicstalk</title>
    <link>http://www.electronicstalk.com/indexes/categorybrowseeh.html</link>
    <description>Heatsinks and thermal management latest news on Electronicstalk</description>
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    <copyright>Copyright (C)2010 Pro-Talk Ltd. All rights reserved.</copyright>
    <pubDate>Mon, 27 Dec 2010 08:00:00 UT</pubDate>
    <lastBuildDate>Mon, 27 Dec 2010 08:00:00 UT</lastBuildDate>
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      <title>Outdoor cooler uses bi-polar thermostatic control</title>
      <description>Laird Technologies has announced the release of its outdoor thermoelectric cooler series with bi-polar thermostatic control.</description>
      <pubDate>Fri, 24 Dec 2010 08:00:00 UT</pubDate>
      <category>Laird Technologies</category>
      <link>http://www.electronicstalk.com/news/lir/lir187.html</link>
    </item>
    <item>
      <title>EMI shielding for medical device enclosures</title>
      <description>Chomerics Europe - a division of Parker Hannifin - has launched Soft-Shield 4850, an EMI shielding material that is suitable for medical applications using electronics equipment for patient care.</description>
      <pubDate>Fri, 19 Nov 2010 08:00:00 UT</pubDate>
      <category>Chomerics</category>
      <link>http://www.electronicstalk.com/news/cho/cho157.html</link>
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      <title>Mosfet packaging features top-side cooling</title>
      <description>In order to meet the needs for high current capability, high efficiency and smaller form factors, Fairchild Semiconductor has developed the Dual Cool packaging for Mosfets.</description>
      <pubDate>Fri, 29 Oct 2010 08:00:00 UT</pubDate>
      <category>Fairchild Semiconductor</category>
      <link>http://www.electronicstalk.com/news/fai/fai493.html</link>
    </item>
    <item>
      <title>Heat sinks have good heat-dissipation properties</title>
      <description>Amec Thermasol has launched a range of micro porous ceramic heat sinks (MPCHS) for high-volume applications such as LED/LCD TVs, computer monitors, set-top boxes, motherboards, media players and more.</description>
      <pubDate>Thu, 30 Sep 2010 08:00:00 UT</pubDate>
      <category>Amec Thermasol</category>
      <link>http://www.electronicstalk.com/news/zaw/zaw100.html</link>
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      <title>Thermal gap filler has low out-gassing properties</title>
      <description>Laird Technologies has released the Tflex XS400 series thermal gap filler designed for telecom, IT, consumer, automotive, LED and power supply applications.</description>
      <pubDate>Thu, 23 Sep 2010 08:00:00 UT</pubDate>
      <category>Laird Technologies</category>
      <link>http://www.electronicstalk.com/news/lir/lir183.html</link>
    </item>
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      <title>Laird unveils Cascade TEAs for wireless products</title>
      <description>Laird Technologies has released its enhanced Cascade Series Thermoelectric Assemblies (TEAs) for advanced electronics and wireless products.</description>
      <pubDate>Wed, 11 Aug 2010 08:00:00 UT</pubDate>
      <category>Laird Technologies</category>
      <link>http://www.electronicstalk.com/news/lir/lir179.html</link>
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    <item>
      <title>Heater extends operating temperature of LCDs</title>
      <description>Therma Klear transparent heaters from Dontech are said to be ideal for applications including avionics displays, vehicle displays, mobile computers, kiosks and handheld devices.</description>
      <pubDate>Wed, 21 Jul 2010 08:00:00 UT</pubDate>
      <category>Dontech</category>
      <link>http://www.electronicstalk.com/news/don/don100.html</link>
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      <title>Thermal-Clad HPL simplifies design and assembly</title>
      <description>Bergquist's HPL dielectric for thermal-clad substrates is optimised for high-power LED lighting and other applications requiring enhanced heat-transfer efficiency.</description>
      <pubDate>Fri, 14 May 2010 08:00:00 UT</pubDate>
      <category>Bergquist</category>
      <link>http://www.electronicstalk.com/news/brg/brg126.html</link>
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    <item>
      <title>Sharp LEDs offer 40,000-hour service life at +80C</title>
      <description>All light-emitting diodes (LEDs) from Sharp Microelectronics have a specified service life of 40,000 operating hours at a substrate temperature of +80C.</description>
      <pubDate>Thu, 08 Apr 2010 08:00:00 UT</pubDate>
      <category>Sharp Microelectronics</category>
      <link>http://www.electronicstalk.com/news/srp/srp184.html</link>
    </item>
    <item>
      <title>ATS heat sinks cool ICs in low-airflow conditions</title>
      <description>Advanced Thermal Solutions has introduced a line of lower-height Maxiflow heat sinks for cooling ICs and other hot components in narrow packaging and low-airflow-velocity conditions.</description>
      <pubDate>Thu, 14 Jan 2010 08:00:00 UT</pubDate>
      <category>Advanced Thermal Solutions</category>
      <link>http://www.electronicstalk.com/news/jau/jau100.html</link>
    </item>
    <item>
      <title>EMKA releases fire-resistant self-adhesive gaskets</title>
      <description>EMKA has announced that its 1016 self-adhesive gasket is available in fire-resistant versions to UL94 VO and 94HB ratings, and in EMC formats to address electrical and magnetic interference.</description>
      <pubDate>Tue, 05 Jan 2010 08:00:00 UT</pubDate>
      <category>EMKA UK</category>
      <link>http://www.electronicstalk.com/news/emk/emk153.html</link>
    </item>
    <item>
      <title>Laird modifies TEAs with cross-flow technology</title>
      <description>Laird has released its modified Tunnel Series Thermoelectric Assemblies (TEAs), designed with a cross-flow technology to maximise heat transfer when pulling air through a heat exchanger.</description>
      <pubDate>Tue, 15 Dec 2009 08:00:00 UT</pubDate>
      <category>Laird Technologies</category>
      <link>http://www.electronicstalk.com/news/lir/lir168.html</link>
    </item>
    <item>
      <title>Gap fillers suit silicone-sensitive applications</title>
      <description>MHandW International has added TP-S3LS ultra-low-silicone gap fillers to its line of thermal interface materials.</description>
      <pubDate>Fri, 23 Oct 2009 08:00:00 UT</pubDate>
      <category>MH and W</category>
      <link>http://www.electronicstalk.com/news/mhw/mhw104.html</link>
    </item>
    <item>
      <title>Schroff dehumidifier protects from condensation</title>
      <description>Schroff has launched a dehumidifier system that is designed to remove moisture from the air within an enclosure to protect electronic and electrical components from condensation.</description>
      <pubDate>Mon, 12 Oct 2009 08:00:00 UT</pubDate>
      <category>Schroff UK</category>
      <link>http://www.electronicstalk.com/news/sch/sch196.html</link>
    </item>
    <item>
      <title>Winshield C is chemical and scratch resistant</title>
      <description>Chomerics Europe, a division of Parker Hannifin, has introduced Winshield C, a shielded window display material that is said to offer a range of benefits compared with existing solutions.</description>
      <pubDate>Tue, 22 Sep 2009 08:00:00 UT</pubDate>
      <category>Chomerics Europe</category>
      <link>http://www.electronicstalk.com/news/cho/cho155.html</link>
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