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Heatsinks and Thermal Management

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LED modules: taking the heat out of the situation

 Technical background article   Managing temperatures using appropriate packaging materials is essential to ensure the reliability of high-power LED applications, explains James Stratford of Universal Science.

News from Universal Science (26 December 2005)

MPU package lids build in thermal management

 Technical background article   Aluminium silicon carbide metal matrix composite materials meet the material property, design and pricing demands for MPU assemblies that require integrated heatsink thermal management solutions.

News from CPS Corp (15 December 2005)

Mastilock to focus on Silicon Valley

Anita Mastilock has joined Dimensions Consulting as Account Manager for the Silicon Valley area.

News from Dimensions Consulting (13 October 2005)

Thermoelectric temperature system comes together

A new range of assemblies from Electron Dynamics provide a fully integrated thermoelectric temperature system in an easy-to-use package.

News from Electron Dynamics ( 4 October 2005)

Patented tubing promises active cooling solutions

CPS has recently been awarded a patent for tubing integrally enveloped within AlSiC thermal management composite