Latest news on Electronicstalk categorised by product type
Heatsinks and Thermal Management
Archive page 6 of 7
Our RSS feed for Heatsinks and Thermal Management press releases
Diamond-copper composite can keep chips cooler
Heathru is a novel low-cost diamond-copper composite material with immediate thermal management applications for semiconductor devices with high power densities.
News from Advanced Diamond Solutions (23 September 2003)
Lightweight heatsinks keep Pentium 4 under control
CoolFin heatsinks allow designers to reduce weight and save space while maximising thermal efficiency.
News from Molex UK (23 September 2003)
Software speeds thermal specification
The latest Pfannenberg PC-based thermal calculation software is now available free of charge on CD.
News from Pfannenberg (UK) (20 August 2003)
Liquid-based system keeps processors cooler
Rittal reckons its innovative, ready-to-install PCS power cooling system is the ideal solution for liquid cooling in standard rack systems. Brochure available
News from Rittal (20 August 2003)
Good conduct helps keep power semis cool
Designers with challenging heat problems can look to a new silicone-gel-based thermal management solution.