Diamond-copper composite can keep chips cooler
Heathru is a novel low-cost diamond-copper composite material with immediate thermal management applications for semiconductor devices with high power densities.
Researchers at Advanced Diamond Solutions have successfully created a low-cost diamond-copper composite material called Heathru, with immediate thermal management applications for semiconductor devices with high power densities.
With thermal conductivities demonstrated over twice that of copper, the material will have dramatic impacts in the microprocessor, memory/graphics, optoelectronics and power electronics industries, where power dissipation concerns are paramount.
Heat has become the most critical issue in computer and semiconductor design in recent years.
The semiconductor industry has c
