‘Industry Standard Footprint’

An Electronicstalk guide

Start with the news release Aries releases Fine-pitch Bump adapters from Aries Electronics, which we summarised at the time by saying "Aries Electronics has launched a series of adapters that allow the use of virtually any SMT IC device on a pitch of 0.4mm or higher, on PC boards on 0.5mm pitch. ". Several months prior to that, we featured the news release Bliss rack supports all Juki feeders from Bliss Industries : "Bliss Industries, a provider of handling carts and racks for electronics assembly, has announced it now provides a rack to support all Juki feeders, including the 700 NF and FF and 2000 CTF models.".
 
In June 2009, we covered the news from Molex UK - take a look at HSAutolink Interconnect System supports USB 2.0 which says: "Molex has announced its HSAutolink Interconnect System, an emerging high-speed data bus that connects portable devices to vehicles, now supports USB 2.0.".
 
Take a look also at the news release from Techcon Systems, Techcon debuts dispensing syringe barrels, as well as 03 series connectors for subsea applications from Lemo UK, and Han-Modular connector system gets 40A crimp module from Harting.
 

Latest stories...
Mosfet H-bridges simplify DC fans and inverters (June 2009)

A range of four H-bridge Mosfet packages from Diodes Incorporated is set to reduce the component count and PCB size of DC fan and CCFL inverter circuits.

DS2 and Cavium offer HD video to flat panels (June 2009)

DS2 and Cavium Networks are offering 1080p60 HD video distribution to flat-panel displays, using DS2 powerline networking devices.

Honda unveils card kits and host connectors (June 2009)

Honda Connectors is supplying 34mm Express card kits and host connectors.

Intersil RS-422 transmitters resist +/- 16.5kV ESD (June 2009)

Intersil has developed a series of small-footprint quad 16.5kV ESD-protected RS-422 transmitters.

Binder adds seven-pin connector to RD24 series (June 2009)

Binder-USA has expanded its line of RD24 series 692 over-moulded connectors with the addition of a seven-pin connector.

Kontron welcomes computer-on-module guide (June 2009)

Kontron has welcomed the publication of the COM Express Carrier Board Design Guide 1.0 by the PCI Industrial Computer Manufacturers Group (PICMG).

TTTech develops TTP simulation model (June 2009)

TTTech, a supplier of networking solutions based on time-triggered technology, has developed a high-performance test module that enables the simulation of a complex TTP system in real time.

Multi-touch Developer Kit launched by 3M (June 2009)

3M Touch Systems has announced a 'true multi-touch' LCD developer kit that tracks up to 10 individual fingers and is compatible with the Microsoft Windows 7 platform.

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