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Product category: Microprocessors, Microcontrollers and DSPs
News Release from: Zilog | Subject: eZ80Acclaim! eZ80F91 in BGA
Edited by the Electronicstalk Editorial Team on 29 October 2003
BGA package shrinks microcontroller
footprint
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A new 144-ball BGA package reduces the size of the eZ80Acclaim! eZ80F91 by 65%, freeing precious PCB real estate for applications in which space is a critical constraint.
A new 144-ball BGA package reduces the size of the eZ80Acclaim! eZ80F91 by 65%, freeing precious PCB real estate for applications in which space is a critical constraint BGA packaging makes it possible to radically reduce the board surface area required for silicon devices