Manncorp releases C250 wave solder machine

The C250 is a small footprint, lead-free wave solder machine.

With dimensions of 50 x 30in (1250 x 760mm), the C250 was originally designed for the Japanese electronics market where factory floor space is a scarcity, but where high precision and reliability remain essential.

Handling boards up to 10in (250mm) wide in its adjustable corrosion-resistant finger conveyor, the C250 is equipped with automatic defluxing, IR preheating, air-knife cooling and an economical low-volume solder pot for reduced start up time and operating costs.

The machine is available in either single or dual wave configurations for through-hole and surface mount assemblies.

It includes built-in solder pot loading, a maintenance platform with locking support-mechanism and dial-adjustable wave height control.

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