News Release from: Unitek Eapro
Edited by the Electronicstalk Editorial Team on 10 June 2003
Desktop systems provide flexible bonding
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
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New from Unitek Eapro is a series of desktop systems for hot bar bonding applications. These desktop systems are designed for maximum flexibility to make connections in the easiest and fastest way possible. Using pulsed heat technology the desktop series can be used for hot bar reflow soldering, ACF bonding, heat-seal bonding and heat stacking.
The desktop systems are a series of modular build systems with different product handling features.
The basic unit, build up by using the following modules; a pulsed heat power supply (Uniflow), a pneumatic bonding head and a quick connect block with thermo-plane thermode.
All modules are mounted on a stiff and easy adjustable frame construction.
The basic unit can be upgraded with a left-right slide, a front-rear slide as well as a manual or pneumatic two-position index table.
Product-specific options like camera alignment modules, Kapton or silicon interposer feeders, water-cooling and fume extraction units can also be provided.
The desktop series are fully CE approved and can be delivered within 3 weeks.
Applications can be found in consumer electronics, automotive electronics, mobile phones, medical devices and many more.
The most common applications are connections from PCB to LCD by means of flexible foils or flat cables.
Unitek Eapro also manufacturers a full range of stand-alone systems, dispensing systems and systems for manufacturing and repairing of large display panels.
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