http://www.electronicstalk.com/indexes/categorybrowsemm.html Electronics manufacturing materials latest news on Electronicstalk en-gb Copyright (C)2010 Pro-Talk Ltd. All rights reserved. Mon, 27 Dec 2010 08:00:00 UT Mon, 27 Dec 2010 08:00:00 UT http://www.pro-talk.com/images/protalklogo90.gif http://www.pro-talk.com/ 90 79 Rogers has introduced XT/duroid high-performance thermoplastic laminate materials, suitable for high-frequency multilayer circuits in military, aerospace and deep-space applications. Mon, 20 Dec 2010 08:00:00 UT Rogers http://www.electronicstalk.com/news/rog/rog153.html Rogers has introduced RT/duroid 6035HTC, a high-thermal-conductivity (HTC) laminate material engineered for low loss in high-power circuits. Fri, 17 Dec 2010 08:00:00 UT Rogers http://www.electronicstalk.com/news/rog/rog152.html Lord has announced the availability of Lord SC-305, a thermally conductive silicone encapsulant designed for encapsulation applications where high heat dissipation is required. Thu, 16 Dec 2010 08:00:00 UT Lord http://www.electronicstalk.com/news/lod/lod114.html A bonded silicon-on-sapphire (SOS) substrate developed by Peregrine and Soitec has been qualified for use in manufacturing Peregrine's next-generation STeP5 UltraCMOS RF IC semiconductors. Mon, 13 Dec 2010 08:00:00 UT Peregrine Semiconductor http://www.electronicstalk.com/news/peg/peg140.html Bulgin's FX0442 and FX0443 PCB-mounting fuseholders are designed for volume applications where PCB mounting offers a fast, economic method of integrating the fuse element into the circuit. Fri, 10 Dec 2010 08:00:00 UT Elektron Technology http://www.electronicstalk.com/news/jej/jej100.html Laser Components' fibre-optics customers can now benefit from anti-reflection coatings on fibres, which have a particularly positive effect in medical technology and material processing. Wed, 01 Dec 2010 08:00:00 UT Laser Components http://www.electronicstalk.com/news/lse/lse157.html Electrolube has launched DCA-HT, a modified silicone conformal coating that has been designed for the protection of electronic circuitry. Tue, 30 Nov 2010 08:00:00 UT Electrolube http://www.electronicstalk.com/news/eec/eec144.html DEK introduces a stencil coating technology, the Nano-Protek wipe, which is designed to increase cleaning effectiveness and reduce cleaning frequency as it renders the stencil surface 'fluxophobic'. Wed, 10 Nov 2010 08:00:00 UT DEK http://www.electronicstalk.com/news/dek/dek296.html Lightcrimp splice technology is a new rapid technique for splicing optical fibres in communications networks. Thu, 04 Nov 2010 08:00:00 UT Tyco Electronics http://www.electronicstalk.com/news/tya/tya372.html Endicott Interconnect Technologies (EI) has added LCP Laminates to its range of microelectronics packaging products. Wed, 03 Nov 2010 08:00:00 UT Endicott Interconnect Technologies http://www.electronicstalk.com/news/enz/enz108.html Rogers Corporation's Poron Shockseal foams are engineered to meet the cushioning, sealing and protection requirements of large LCD displays. Fri, 29 Oct 2010 08:00:00 UT Rogers http://www.electronicstalk.com/news/rog/rog151.html Intertronics has introduced the latest range of fast room-temperature-cure electronics adhesives from Dymax, which are particularly focused towards harsh-duty electronics applications. Mon, 25 Oct 2010 08:00:00 UT Intertronics http://www.electronicstalk.com/news/ind/ind191.html Rittal has introduced a rapid-assembly subrack, which is suitable for standard Euroboards in 3U and 6U formats. Wed, 29 Sep 2010 08:00:00 UT Rittal http://www.electronicstalk.com/news/rit/rit237.html Harwin has introduced a range of surface-mount wire management cable clips that is suited for high-volume commercial and industrial markets as well as consumer electronics applications. Thu, 23 Sep 2010 08:00:00 UT Harwin http://www.electronicstalk.com/news/haa/haa165.html Laird Technologies, a supplier of customised performance-critical components for advanced electronics and wireless products, has released a rigid corner board-level shield (BLS). Tue, 21 Sep 2010 08:00:00 UT Laird Technologies http://www.electronicstalk.com/news/lir/lir182.html