Product category: Communications ICs (Wireless)
News Release from: Telecis Wireless
Edited by the Electronicstalk Editorial Team on 14 October 2005
Alliance marries WiMAX chips with
antennas
ArrayComm and Telecis Wireless have signed a joint development agreement to create products for the upcoming WiMAX "e" (mobile) standard.
ArrayComm and Telecis Wireless have signed a joint development agreement to create products for the upcoming WiMAX "e" (mobile) standard ArrayComm is the industry leader in smart antenna technology for wireless access (BWA) systems
This article was originally published on Electronicstalk on 25 Apr 2006 at 8.00am (UK)
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