The EDA Technology Leader

Product category: Reference Designs
News Release from: TTPCom
Edited by the Electronicstalk Editorial Team on 24 January 2003

First silicon produced
for 3GPP transceiver

Register for the FREE Electronicstalk email newsletter now! News about Reference Designs and more every issue. Click here for details.

TTPCom and Matsushita Electric Industrial have reached a significant milestone in achieving functional first silicon of a 3GPP transceiver design based on TTPCom technology

TTPCom and the Semiconductor Company of Matsushita Electric Industrial (MEI) have reached a significant milestone in achieving functional first silicon of a 3GPP transceiver design based on TTPCom technology. The first devices have been evaluated and shown to meet the specifications set for 3GPP.

Full system evaluation is now underway at TTPCom's testing facilities, with first production samples expected in the second half of 2003.

The TTPCom reference design delivered to MEI was optimised to meet its specific requirements for a 3GPP only transceiver.

Development of a dual GSM/3G transceiver continues, with first silicon expected in mid 2003.

"Bringing together the systems expertise and experience of TTPCom with the silicon design expertise of our team enabled us to reduce development time for the 3G transceiver", said MEI Product Manager, Hiroyuki Ushihara.

He continued, "The co-operation worked very well and TTPCom continues to work with us supporting the discussions we are having with handset manufacturers who are interested in using our RFICs".

TTPCom's RFIC core Product Manager, Gerry Stanton said: "We are very pleased to see working 3GPP RFICs on the bench.

Our teams worked closely to optimise our reference IP to meet the MEI design goals.

Seeing working silicon validates our IP, MEI's circuit design and our model of co-working".

MEI has a strong background in RF design for systems such as the Japanese PDC system.

Its range of RFICs for 2.5 and 3G systems is designed to allow handset partners to implement these technologies with minimal design overhead.

The forthcoming dual 3G/GSM RFICs will enable handsets that are capable of operating with 2G/2.5G and 3G networks, allowing subscribers seamless access to different networks as the world's cellular operators roll out new 3G services.

This capability could be vital to the successful introduction of 3G services as it is unlikely that today's subscribers will be prepared to tolerate any loss of service when they move to areas only covered by 2 and 2.5G systems.

TTPCom: contact details and other news
Email this article to a colleague
Register for the free Electronicstalk email newsletter
Electronicstalk Home Page

Related Business News

Forsys Receives Pre-Feasibility Study on the Valencia Uranium Deposit
Toronto, Ontario-- - Forsys Metals Corp. is pleased to announce the completion of the Pre-Feasibility Study for the Company's flagship Valencia Uranium Project in Namibia.

Qualstar Reports Fiscal 2007 Third Quarter Results
Qualstar Corporation , a manufacturer of automated tape storage solutions, today reported financial results for the third quarter of fiscal 2007 ended March 31, 2007.

Transbotics Appoints Charles Robison as CEO
Transbotics Corporation, , announced that its board of directors appointed director Charles Robison, to serve as Vice Chairman of the Board and Chief Executive Officer, effective immediately.

Senior Designer - Intimate Apparel -...
...Hong Kong / China.

Avoid wireless USB pitfalls
When undertaking a project that involves an emerging technology such as wireless USB, you face many new problems. Here are points you must consider for wireless USB product development.

Search the Pro-Talk network of sites

The EDA Technology Leader