Product category: Reference Designs
News Release from: TTPCom
Edited by the Electronicstalk Editorial Team on 19 March 2002
IBM joins TTPCom
in dual-system development
IBM has licensed TTPCom's dual system 3G/GSM technology for radio chipsets
TTPCom's technology delivers a system level and architectural design together with IC specifications from which IBM can rapidly develop low power RFICs, based on its industry leading SiGe technology, for use in next generation wireless devices. "The combination of TTPCom's IP and IBM's leadership in silicon germanium (SiGe) technology will enable us to broaden our circuit portfolio and meet 3G demands", said Ken Torino, director, wireless products, IBM Microelectronics.
This article was originally published on Electronicstalk on 19 March 2002 at 8.00am (UK)
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IBM was the first company to broadly manufacture silicon germanium products.
TTPCom's dual system 3G/GSM RFIC architecture enables the design of terminals, such as handsets, capable of operating with 2G, 2.5G and 3G networks, allowing subscribers seamless access to these different network standards as the world's cellular operators migrate to 3G services.
"We're very pleased to be working with IBM on 3G/GSM dual system RFIC development", said Gordon Aspin, Operations Director, TTPCom, "This is our second licence agreement for 3G radio chipsets, which demonstrates that the market sees the value in TTPCom's IP based approach to RFICs.
This IP gives our clients instant access to our extensive RF design expertise and enables them to benefit from our familiarity with GSM and 3G standards".
He concluded, "Combining TTPCom's RFIC experience and understanding of the standards with IBM's circuit design skills and state of the art process technology will enable very high performance RFICs to be developed for the upcoming dual-system terminal market".
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