News Release from: Transmeta Corp
Subject: Efficeon Technology Reference Design Kit
Edited by the Electronicstalk Editorial Team on 10 January 2005

Reference design kit checks out frugal processor

Transmeta Corp has released a new Efficeon processor technology evaluation platform and reference design kit for the next generation of energy efficient, high performance, fanless and compact designs.

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Transmeta Corp has released a new Efficeon processor technology evaluation platform and reference design kit for the next generation of energy efficient, high performance, fanless and compact designs. The Efficeon Technology Reference Design Kit is a manufacturing-ready reference design comprising schematics, PCB layout, bill of materials, reference design guide and drivers with BIOS support available from multiple BIOS vendors. The hardware platform is a four-layer Mini-ITX form factor motherboard, measuring 170 x 170mm, including onboard video/graphics, audio, Ethernet, USB 2.0, and IDE interfaces.

Designed for customers demanding high performance in low power designs, the manufacturing ready reference design kit allows for rapid evaluation and adoption of Transmeta's technologies for a diverse range of industrial and computing products including embedded systems, automotive applications, quiet media centres, high performance consumer electronic devices and more.

'With Transmeta's increased focus on intellectual property licensing, this platform is an attractive vehicle for potential licensees to evaluate Transmeta's processor technology', said Arthur L Swift, Senior Vice President of Marketing at Transmeta.

'The high level of integration of this complete system design showcases the ability to integrate our efficient technology into next generation applications requiring x86 compatibility in high performance compact designs'.

The reference design kit includes an Efficeon TM8820 in a 21 x 21mm package.

The TM8820 supports Transmeta's powerful AntiVirusNX Technology, which works in conjunction with Microsoft's Windows XP Service Pack 2 and offers enhanced security and safer computing by detecting and disabling common forms of computer viruses and worms.

Additionally, the included Efficeon processor features lead-free packaging developed in accordance with industry wide initiatives such as the Restriction of hazardous substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE) Directives and is aligned with Japan Electronics and Information Technology Industries Association (JEITA) to remove lead and other hazardous materials from product packaging.

The Efficeon Processor Technology Evaluation Platform and Reference Design Kit will be available to customers in Q1 2005.

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