News Release from: Transition Automation
Edited by the Electronicstalk Editorial Team on 29 June 2005
Squeegee holder set to clean up
A novel squeegee holder aims to improve SMT printing by incorporating a self-cleaning wiper system.
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Available now from Transition Automation is a novel squeegee holder that improves SMT printing by incorporating a self-cleaning wiper system. Both lead-free and traditional solder paste printing processes exhibit a high degree of solder paste sticking. This sticking produces undesirable effects, such as paste bleeding defects, premature contamination of the stencil surface, and requirement for more cleaning interruption.
Process cycle time is affected negatively as the paste requires time to drop off the squeegee after each print stroke.
The new invention achieves a significant reduction of solder paste sticking by way of two small articulating wiper wires.
In one experiment, a reduction of 48% of solder paste adhesion was achieved.
Results may vary depending on the particular viscosity and rheology of the solder paste.
In some cases, users may benefit by altering their solder paste formulations to be more sticky and viscous (which improves printing), without the additional paste sticking worries.
The new devices is offered across the full Permalex metal squeegee product line, and may be retrofitted on most popular SMT printing machines.
There are no additional hookups or machine interfacing required, as the system is passively actuated by the motion of the squeegee holder.
Using the highest quality squeegee is becoming even more important as the industry moves toward lead free assembly.
Permalex squeegees offer improved printing in lead free environments.
This new product offering is consistent with Transition Automation's strategy of increasing the performance and value of SMT production lines with long-life value added innovations at the squeegee.
This new design achieves a high degree of functionality with 'minimalist' materials and impact on the SMT process.
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