Product category: Power Supply ICs and Controllers
News Release from: Toshiba Electronics Europe | Subject: 600 and 1200V C-IPMs
Edited by the Electronicstalk Editorial Team on 12 May 2003
Low thermal resistance
for smart power modules
Toshiba's latest 600 and 1200V compact intelligent power modules (C-IPMs) feature thermal resistance ratings up to 50% lower than previous technologies
The result is a family of devices that allow designers to save board space, reduce component count and minimise cooling requirements without sacrificing functionality or output power. Suitable for general-purpose inverters and motor drives, the new C-IPMs integrate up to seven IGBTs and high levels of built-in intelligence into a single package.
This article was originally published on Electronicstalk on 12 May 2003 at 8.00am (UK)
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Toshiba has been able to achieve thermal resistance values as low as 0.033C/W by using silicon nitride (SiN) rather than aluminium oxide (Al203) as an insulation substrate, and by reducing isolation plate thickness by 50% to just 0.32mm.
These changes mean that the IGBTs used in the new 600V, 100A C-IPM, for example, have a thermal resistance of just 0.21C/W, which is 50% lower than the figure for previous generation IGBTs with the same rating.
Because of this, module size can be reduced, while the level of cooling that the designer needs to incorporate into the application can be minimised.
Toshiba's new 600V and 1200V C-IPM modules are available with current ratings of 50, 75, 100, 150, 200, 300 and 400A.
The 600V versions also offer a 600A option.
High levels of built-in intelligence in the form of driving circuitry and protection lead to significantly simplified designs.
A power supply and photocouplers are the only additional components needed to implement a fully operational system.
Protection incorporated within the new C-IPMs includes control supply undervoltage protection and protection against short-circuit conditions.
Overcurrent and overtemperature protection are also provided, as is circuitry for high-side and low-side fault output indication.
The new C-IPM devices can be supplied with a variety of configurations including two-in-one, six-in-one and seven-in-one variants.
Brake chopper functionality is also available on certain modules.
Module dimensions start at just 107 x 55 x 18.5mm and are only 122 x 62 x 20mm for the largest 1200V, 400A device.
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